Omid Mokhtari

Correlation between microstructure and mechanical properties of Sn–Bi–X solders

Omid Mokhtari, Hiroshi Nishikawa · Materials Science and Engineering A · 2015 · 149 citations

Materials Science, Engineering, Mechanical Properties +4

Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni–P substrates

Hiren R. Kotadia, Omid Mokhtari, M.P. Clode et al. · Journal of Alloys and Compounds · 2011 · 118 citations

Materials Science, Materials Engineering, Material Analysis +9

Improvement in the mechanical properties of eutectic Sn58Bi alloy by 0.5 and 1 wt% Zn addition before and after thermal aging

Shiqi Zhou, Omid Mokhtari, Muhammad Ghufran Rafique et al. · Journal of Alloys and Compounds · 2018 · 86 citations

Materials Science, Materials Engineering, Eutectic Sn58bi Alloy +8

A review: Formation of voids in solder joint during the transient liquid phase bonding process - Causes and solutions

Omid Mokhtari · Microelectronics Reliability · 2019 · 78 citations

Materials Science, Engineering, Mechanical Engineering +2

Effects of Ti addition on the microstructure, mechanical properties and electrical resistivity of eutectic Sn58Bi alloy

Shiqi Zhou, Chih-han Yang, Shih‐kang Lin et al. · Materials Science and Engineering A · 2018 · 66 citations

Materials Science, Materials Engineering, Eutectic Sn58bi Alloy +8