Concepedia

Chih-han Yang

CY

Statistics

Publications

5

Citations

285

H-Index

5

Active since

2018

Affiliations

The University of Osaka(Current)

National Cheng Kung University

Chih-han Yang is an author at The University of Osaka specializing in mechanical engineering, materials engineering, and engineering.

Top concepts

Publications per year

2018–2021

5

Publications

5

Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology

Yu-An Shen, Shiqi Zhou, Jiahui Li et al. · Materials & Design · 2019 · 85 citations · Full text

Effects of Ti addition on the microstructure, mechanical properties and electrical resistivity of eutectic Sn58Bi alloy

Shiqi Zhou, Chih-han Yang, Shih‐kang Lin et al. · Materials Science and Engineering A · 2018 · 66 citations

, , +8

Improvements in mechanical properties of Sn–Bi alloys with addition of Zn and In

Yuki Hirata, Chih-han Yang, Shih‐kang Lin et al. · Materials Science and Engineering A · 2021 · 58 citations

, , +6

The newly developed Sn–Bi–Zn alloy with a low melting point, improved ductility, and high ultimate tensile strength

Shiqi Zhou, Chih-han Yang, Yu-An Shen et al. · Materialia · 2019 · 50 citations

, , +5

A Computational Thermodynamics-Assisted Development of Sn-Bi-In-Ga Quaternary Alloys as Low-Temperature Pb-Free Solders

Chih-han Yang, Shiqi Zhou, Shih‐kang Lin et al. · Materials · 2019 · 26 citations · Full text

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