Concepedia

Jiahui Li

JL

15

Publications

515

Citations

14

H-Index

2015

Active since

Affiliations

The University of Osaka(Current)

China University of Science and Technology

Feng Chia University

Minghsin University of Science and Technology

City University of Hong Kong

Jiahui Li is an author at The University of Osaka specializing in engineering, materials science, and materials engineering.

ORCID

Top concepts

Publications per year

2015–2024

15

Publications

15

Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology

Yu-An Shen, Shiqi Zhou, Jiahui Li et al. · Materials & Design · 2019 · 85 citations · Full text

Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate during Solid-state Aging

Yu-An Shen, Chun-Ming Lin, Jiahui Li et al. · Scientific Reports · 2019 · 75 citations · Full text

Thermomigration induced microstructure and property changes in Sn-58Bi solders

Yu-An Shen, Shiqi Zhou, Jiahui Li et al. · Materials & Design · 2019 · 55 citations · Full text

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Interfacial transformation of preoxidized Cu microparticles in a formic-acid atmosphere for pressureless Cu–Cu bonding

Runhua Gao, Siliang He, Jiahui Li et al. · Journal of Materials Science Materials in Electronics · 2020 · 36 citations

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Thymopentin alleviates premature ovarian failure in mice by activating YY2/Lin28A and inhibiting the expression of let‐7 family microRNAs

Te Liu, Fangyuan Jing, Peirong Huang et al. · Cell Proliferation · 2021 · 35 citations · Full text

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