Jiahui Li - Concepedia

Author

Jiahui Li

The University of Osaka ORCID

Also Known As

Jiahui Li

Publications

556

Citations

H-Index

Concepts

All Affiliations

The University of Osaka China University of Science and Technology Feng Chia University Minghsin University of Science and Technology City University of Hong Kong

About

Jiahui Li is an author at The University of Osaka specializing in engineering, materials science, and materials engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	9	9	244
2	Chemical Engineering	4	4	106
3	Applied Physics	3	3	103
4	Chemistry	2	2	63
5	Natural Sciences	1	1	14

Jiahui Li

Publications

515

Citations

H-Index

Page 1

	Year	Citations
Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology Yu-An Shen, Shiqi Zhou, Jiahui Li, Materials & Design	2019	85
Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate during Solid-state Aging Yu-An Shen, Chun-Ming Lin, Jiahui Li, Scientific Reports	2019	75
Thermomigration induced microstructure and property changes in Sn-58Bi solders Yu-An Shen, Shiqi Zhou, Jiahui Li, Materials & Design EngineeringThermal ConductivityThermodynamicsPhase SeparationElectronic Packaging	2019	55
Interfacial transformation of preoxidized Cu microparticles in a formic-acid atmosphere for pressureless Cu–Cu bonding Runhua Gao, Siliang He, Jiahui Li, Journal of Materials Science Materials in Electronics Materials ScienceChemical EngineeringEngineeringSurface SciencePressureless Cu–cu Bonding	2020	36
Thymopentin alleviates premature ovarian failure in mice by activating YY2/Lin28A and inhibiting the expression of let‐7 family microRNAs Te Liu, Fangyuan Jing, Peirong Huang, Cell Proliferation	2021	35
Investigation of FeCoNiCu properties: Thermal stability, corrosion behavior, wettability with Sn-3.0Ag-0.5Cu and interlayer formation of multi-element intermetallic compound Yu-An Shen, H.Y. Hsieh, Shih-Hsun Chen, Applied Surface Science Materials ScienceMaterials EngineeringEngineeringCorrosionSurface Science	2021	34
Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment Chin-Hao Tsai, Weichen Huang, Ly May Chew, Journal of Materials Research and Technology	2021	34
Behavior of Sn-3.0Ag-0.5Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere Siliang He, Yu-An Shen, Bifu Xiong, Journal of Materials Research and Technology	2022	29
In-situ observation of fluxless soldering of Sn-3.0Ag-0.5Cu/Cu under a formic acid atmosphere Siliang He, Runhua Gao, Jiahui Li, Materials Chemistry and Physics Materials ScienceMaterials EngineeringChemical EngineeringFormic Acid AtmosphereEngineering	2019	27
Wettability, interfacial reactions, and impact strength of Sn–3.0Ag–0.5Cu solder/ENIG substrate used for fluxless soldering under formic acid atmosphere Siliang He, Runhua Gao, Yu-An Shen, Journal of Materials Science Materials ScienceMaterials EngineeringChemical EngineeringInterfacial ReactionsFormic Acid Atmosphere	2019	24

Page 1