Siliang He - Concepedia

Author

Siliang He

The University of Osaka ORCID

Also Known As

Baoliang Gong, He, Siliang, S. He, Si Liang He, Siliang He

Publications

626

Citations

H-Index

Concepts

All Affiliations

The University of Osaka Guilin University of Electronic Technology Feng Chia University Institute of Semiconductors Guangdong Academy of Sciences

About

Siliang He is an author at The University of Osaka specializing in materials science, engineering, and materials engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	12	13	409
2	Applied Physics	4	4	121
3	Chemical Engineering	4	4	122
4	Chemistry	2	2	63
5	Biomedical Engineering	1	1	15

Siliang He

Publications

494

Citations

H-Index

Page 1

	Year	Citations
Thermally stable Cu 3 Sn/Cu composite joint for high-temperature power device Xiangdong Liu, Siliang He, Hiroshi Nishikawa Scripta Materialia Materials ScienceMaterials EngineeringElectrical EngineeringEngineeringElectronic Packaging	2015	83
Low temperature solid-state bonding using Sn-coated Cu particles for high temperature die attach Xiangdong Liu, Siliang He, Hiroshi Nishikawa Journal of Alloys and Compounds Materials ScienceMaterials EngineeringSn-coated Cu ParticlesThermal Spray CoatingEngineering	2016	68
Interfacial transformation of preoxidized Cu microparticles in a formic-acid atmosphere for pressureless Cu–Cu bonding Runhua Gao, Siliang He, Jiahui Li, Journal of Materials Science Materials in Electronics Materials ScienceChemical EngineeringEngineeringSurface SciencePressureless Cu–cu Bonding	2020	36
Effect of Substrates on Fracture Mechanism and Process Optimization of Oxidation–Reduction Bonding with Copper Microparticles Runhua Gao, Siliang He, Yu-An Shen, Journal of Electronic Materials Materials ScienceChemical EngineeringCopper MicroparticlesEngineeringMaterial Processing	2019	35
Effect of Cu addition on the microstructure and mechanical properties of In–Sn-based low-temperature alloy Duy Le Han, Yu-An Shen, Siliang He, Materials Science and Engineering A Materials ScienceMaterials EngineeringCu AdditionHigh Temperature MaterialsEngineering	2021	32
Behavior of Sn-3.0Ag-0.5Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere Siliang He, Yu-An Shen, Bifu Xiong, Journal of Materials Research and Technology	2022	29
In-situ observation of fluxless soldering of Sn-3.0Ag-0.5Cu/Cu under a formic acid atmosphere Siliang He, Runhua Gao, Jiahui Li, Materials Chemistry and Physics Materials ScienceMaterials EngineeringChemical EngineeringFormic Acid AtmosphereEngineering	2019	27
Wettability, interfacial reactions, and impact strength of Sn–3.0Ag–0.5Cu solder/ENIG substrate used for fluxless soldering under formic acid atmosphere Siliang He, Runhua Gao, Yu-An Shen, Journal of Materials Science Materials ScienceMaterials EngineeringChemical EngineeringInterfacial ReactionsFormic Acid Atmosphere	2019	24
Novel polarity effect on intermetallic compound thickness changes during electromigration in Cu/Sn-3.0Ag-0.5Cu/Cu solder joints Zhi Hao Jin, Yu-An Shen, Siliang He, Journal of Applied Physics Materials ScienceMaterials EngineeringElectrical EngineeringElectromigration TechniqueImc Growth	2019	22
Molecular Dynamics Simulation of Sintering Densification of Multi-Scale Silver Layer Peijie Liang, Zhiliang Pan, Liang Tang, Materials EngineeringMechanical EngineeringMaterial SimulationMultiscale MaterialPowder Compaction	2022	21

Page 1