Concepedia

Siliang He

SH

19

Publications

494

Citations

13

H-Index

2015

Active since

Affiliations

The University of Osaka(Current)

Guilin University of Electronic Technology

Feng Chia University

Institute of Semiconductors

Guangdong Academy of Sciences

Siliang He is an author at The University of Osaka specializing in materials science, engineering, and materials engineering.

Top concepts

EngineeringMaterial ScienceMaterials EngineeringSurface ScienceElectronic PackagingMicrostructureApplied PhysicsChemical EngineeringCorrosionNanomaterials

Publications per year

2015–2023

19

Publications

19

Thermally stable Cu 3 Sn/Cu composite joint for high-temperature power device

Xiangdong Liu, Siliang He, Hiroshi Nishikawa · Scripta Materialia · 2015 · 83 citations

Materials Science, Materials Engineering, Electrical Engineering +9

Low temperature solid-state bonding using Sn-coated Cu particles for high temperature die attach

Xiangdong Liu, Siliang He, Hiroshi Nishikawa · Journal of Alloys and Compounds · 2016 · 68 citations

Materials Science, Materials Engineering, Sn-coated Cu Particles +12

Interfacial transformation of preoxidized Cu microparticles in a formic-acid atmosphere for pressureless Cu–Cu bonding

Runhua Gao, Siliang He, Jiahui Li et al. · Journal of Materials Science Materials in Electronics · 2020 · 36 citations

Materials Science, Chemical Engineering, Engineering +5

Effect of Substrates on Fracture Mechanism and Process Optimization of Oxidation–Reduction Bonding with Copper Microparticles

Runhua Gao, Siliang He, Yu-An Shen et al. · Journal of Electronic Materials · 2019 · 35 citations

Materials Science, Chemical Engineering, Copper Microparticles +9

Effect of Cu addition on the microstructure and mechanical properties of In–Sn-based low-temperature alloy

Duy Le Han, Yu-An Shen, Siliang He et al. · Materials Science and Engineering A · 2021 · 32 citations

Materials Science, Materials Engineering, Cu Addition +8

Rows per page

1–5 of 19