Publication | Closed Access

Effect of Substrates on Fracture Mechanism and Process Optimization of Oxidation–Reduction Bonding with Copper Microparticles

Materials ScienceChemical EngineeringCopper MicroparticlesEngineeringMaterial ProcessingCorrosionOxidation ResistanceNanomanufacturingProcess OptimizationMetal ProcessingCorrosion ResistanceOxidation–reduction Bonding