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Low-pressure Cu-Cu bonding using in-situ surface-modified microscale Cu particles for power device packaging

Materials ScienceWafer Scale ProcessingPower Device PackagingEngineeringAdvanced Packaging (Semiconductors)MicrofabricationNanomaterialsLow-pressure Cu-cu BondingChip-scale PackageApplied PhysicsChip AttachmentElectronic PackagingMicroelectronics