Runhua Gao

Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate during Solid-state Aging

Yu-An Shen, Chun-Ming Lin, Jiahui Li et al. · Scientific Reports · 2019 · 75 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

A novel strategy for GaN-on-diamond device with a high thermal boundary conductance

Fengwen Mu, Bin Xu, Xinhua Wang et al. · Journal of Alloys and Compounds · 2022 · 46 citations

Engineering, Materials Engineering, Materials Science +16

Improvement of oxidation resistance and bonding strength of Cu nanoparticles solder joints of Cu–Cu bonding by phosphating the nanoparticle

Yang Zuo, Jun Shen, Youdian Hu et al. · Journal of Materials Processing Technology · 2017 · 41 citations

Natural Sciences, Materials Engineering, Materials Science +16

Enhanced corrosion resistance of magnesium alloy by a silane-based solution treatment after an in-situ formation of the Mg(OH)2 layer

Fubao Gong, Jun Shen, Runhua Gao et al. · Applied Surface Science · 2016 · 40 citations

Natural Sciences, Materials Engineering, Materials Science +16

Effect of different sizes of Cu nanoparticles on the shear strength of Cu-Cu joints

Yang Zuo, Jun Shen, Heng Xu et al. · Materials Letters · 2017 · 40 citations

Engineering, Materials Engineering, Materials Science +17