Yang Zuo

Quasi-in-situ observation of the grain growth and grain boundary movement in sintered Cu nanoparticle interconnects

Yang Zuo, Ana Robador, M Wickham et al. · Acta Materialia · 2022 · 57 citations

Engineering, Materials Engineering, Materials Science +17

Influence of Cu micro/nano-particles mixture and surface roughness on the shear strength of Cu-Cu joints

Yang Zuo, Jun Shen, Jiacheng Xie et al. · Journal of Materials Processing Technology · 2018 · 48 citations

Engineering, Materials Engineering, Materials Science +15

High bond strength Cu joints fabricated by rapid and pressureless in situ reduction-sintering of Cu nanoparticles

Yang Zuo, Sadie Carter‐Searjeant, Mark Green et al. · Materials Letters · 2020 · 43 citations

Engineering, Materials Engineering, Materials Science +14

Improvement of oxidation resistance and bonding strength of Cu nanoparticles solder joints of Cu–Cu bonding by phosphating the nanoparticle

Yang Zuo, Jun Shen, Youdian Hu et al. · Journal of Materials Processing Technology · 2017 · 41 citations

Natural Sciences, Materials Engineering, Materials Science +16

Effect of different sizes of Cu nanoparticles on the shear strength of Cu-Cu joints

Yang Zuo, Jun Shen, Heng Xu et al. · Materials Letters · 2017 · 40 citations

Engineering, Materials Engineering, Materials Science +17