Publication | Closed Access

Low temperature solid-state bonding using Sn-coated Cu particles for high temperature die attach

Materials ScienceMaterials EngineeringSn-coated Cu ParticlesThermal Spray CoatingEngineeringSurface ScienceApplied PhysicsChip AttachmentHigh-performance MaterialMaterial PerformanceElectronic PackagingLow Temperature Solid-stateHigh TemperatureMicrostructureCladding (Metalworking)