Publication | Closed Access
Thermally stable Cu 3 Sn/Cu composite joint for high-temperature power device
83
Citations
12
References
2015
Year
Materials ScienceMaterials EngineeringElectrical EngineeringEngineeringElectronic PackagingHeat TransferSn/cu Composite JointThermal EngineeringStable Cu 3Thermal ConductivityThermal PropertyHigh-temperature Power Device
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