Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology - Concepedia

Concepedia

Publication | Open Access

Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology

DOI Full Paper Access

85

Citations

36

References

2019

Year

Yu-An Shen, Shiqi Zhou, Jiahui Li, Chih-han Yang, Sijie Huang, Shih‐kang Lin, Hiroshi Nishikawa

Materials & Design

References

	Year	Citations

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