Concepedia

Thermal Mismatch

Thermal Mismatch is a physical phenomenon in the joining of dissimilar materials characterized by differential thermal expansion or contraction between adjacent materials due to temperature changes, leading to residual stresses or distortions at the interface.

467

Publications

20.9K

Citations

1.9K

Authors

549

Institutions

Publications per year

2017–2026

112

Variants

Coefficient Of Thermal Expansion MismatchCte Mismatch

Parents

Publications

467

Herringbone Buckling Patterns of Compressed Thin Films on Compliant Substrates

Xi Chen, John W. Hutchinson · Journal of Applied Mechanics · 2004 · 587 citations

, , +17

Controlling threading dislocation densities in Ge on Si using graded SiGe layers and chemical-mechanical polishing

M. T. Currie, Srikanth Samavedam, T. A. Langdo et al. · Applied Physics Letters · 1998 · 551 citations

, , +17

Optical absorption edge of ZnO thin films: The effect of substrate

V. Srikant, David R. Clarke · Journal of Applied Physics · 1997 · 452 citations

, , +17

Stress and its effect on optical properties of GaN epilayers grown on Si(111), 6H-SiC(0001), and <i>c</i>-plane sapphire

Degang Zhao, Shijie Xu, Mingyu Xie et al. · Applied Physics Letters · 2003 · 420 citations

, , +17

Measurement of Strains at Si-SiO2 Interface

R. J. Jaccodine, William A. Schlegel · Journal of Applied Physics · 1966 · 403 citations

, , +17

1–5 of 467

Authors

1.9K

  1. ES
    E. Suhir

    AT&T (United States), United States

    9 publications · 247 citations

    9

    h-index

  2. HR
    H. Reichl

    Fraunhofer Institute for Reliability and Microintegration, Germany

    7 publications · 136 citations

    7

    h-index

  3. PG
    Peifeng Gao

    Lanzhou University, China

    6 publications · 329 citations

    6

    h-index

  4. HZ
    H. Zogg

    ETH Zurich, Switzerland

    5 publications · 216 citations

    5

    h-index

  5. DR
    David R. Clarke

    University of California, Santa Barbara, United States

    5 publications · 630 citations

    5

    h-index

1–5 of 1.9K

Institutions

549

  1. American Ceramic Society

    Westerville, United States

    16 h-index

    45 publications

    2.7K citations

  2. University of California, Santa Barbara

    Santa Barbara, United States

    13 h-index

    41 publications

    3.3K citations

  3. Chinese Academy of Sciences

    Beijing, China

    11 h-index

    74 publications

    5.4K citations

  4. Georgia Institute of Technology

    Atlanta, United States

    10 h-index

    31 publications

    954 citations

  5. Harbin Institute of Technology

    Harbin, China

    10 h-index

    37 publications

    1.2K citations

  6. Fraunhofer Institute for Reliability and Microintegration

    Berlin, Germany

    10 h-index

    46 publications

    813 citations

  7. Tsinghua University

    Beijing, China

    9 h-index

    34 publications

    1.1K citations

  8. National Tsing Hua University

    Hsinchu, Taiwan

    8 h-index

    16 publications

    260 citations

1–8 of 549

Venues

  1. Journal of Applied Physics

    34 publications · 2.3K citations

    22

    h-index

  2. Journal of the American Ceramic Society

    27 publications · 1.4K citations

    20

    h-index

  3. Applied Physics Letters

    25 publications · 2K citations

    19

    h-index

  4. Journal of Electronic Packaging

    9 publications · 213 citations

    9

    h-index

  5. 7

    h-index

1–5