Shih‐kang Lin - Concepedia

Author

Shih‐kang Lin

Also Known As

Chih-han Yang, Haydee Camposano, LIN, Shih-Kang, S.-K. Lin, S.K. Lin, Shih-Kang Lin, Shih-kang LIN, Shih-kang Lin, Shih‐Kang Lin, Shih‐kang Lin

179

Publications

2.7K

Citations

H-Index

Concepts

All Affiliations

National Cheng Kung University National Tsing Hua University The University of Osaka Forschungszentrum Jülich National Synchrotron Radiation Research Center

About

Shih‐kang Lin is an author at National Cheng Kung University specializing in engineering, materials science, and materials engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	24	43	1.7K
2	Applied Physics	15	20	879
3	Chemical Engineering	3	3	88
4	Natural Sciences	1	1	249
5	Behavioral Sciences	1	1	86

Shih‐kang Lin

Publications

2.5K

Citations

H-Index

Page 1

	Year	Citations
Ab initio study of sodium intercalation into disordered carbon Ping-chun Tsai, Sai-Cheong Chung, Shih‐kang Lin, Journal of Materials Chemistry A EngineeringLarger Interlayer DistancesSolid-state ChemistryChemistryDefect Tolerance	2015	249
Phase Diagrams of Pb-Free Solders and their Related Materials Systems Sinn-wen Chen, Chao Hong Wang, Shih‐kang Lin, Journal of Materials Science Materials in Electronics Materials EngineeringPhase DiagramsMaterials ScienceEngineeringApplied Physics	2006	122
Low temperature sintering of fully inorganic all-solid-state batteries – Impact of interfaces on full cell performance Martin Ihrig, Martin Finsterbusch, Chih‐Long Tsai, Journal of Power Sources Materials ScienceElectrical EngineeringSinteringEngineeringLi-ion Battery Materials	2020	89
Nano-volcanic Eruption of Silver Shih‐kang Lin, Shijo Nagao, Emi Yokoi, Scientific Reports	2016	88
Interfacial Reactions in Cu/Ga and Cu/Ga/Cu Couples Shih‐kang Lin, Cheng-liang Cho, Hao-miao Chang Journal of Electronic Materials Interfacial ReactionsBehavioral SciencesIntimate RelationshipPersonal RelationshipInterracial Relationship	2013	86
Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology Yu-An Shen, Shiqi Zhou, Jiahui Li, Materials & Design	2019	85
Atomistic Structure and Ab Initio Electrochemical Properties of Li<sub>4</sub>Ti<sub>5</sub>O<sub>12</sub>Defect Spinel for Li Ion Batteries Ping‐Chun Tsai, Wen-Dung Hsu, Shih‐kang Lin Journal of The Electrochemical Society EngineeringOther Defect SpinelDefect SpinelChemistryAtomistic Structure	2014	79
Effective suppression of interfacial intermetallic compound growth between Sn–58wt.% Bi solders and Cu substrates by minor Ga addition Shih‐kang Lin, Trong Lan Nguyen, Shu-chang Wu, Journal of Alloys and Compounds Materials ScienceMaterial AnalysisEffective SuppressionEngineeringSurface Science	2013	71
Study of LiCoO<sub>2</sub>/Li<sub>7</sub>La<sub>3</sub>Zr<sub>2</sub>O<sub>12</sub>:Ta Interface Degradation in All-Solid-State Lithium Batteries Martin Ihrig, Martin Finsterbusch, Alexander M. Laptev, ACS Applied Materials & Interfaces	2022	68
Effects of Ti addition on the microstructure, mechanical properties and electrical resistivity of eutectic Sn58Bi alloy Shiqi Zhou, Chih-han Yang, Shih‐kang Lin, Materials Science and Engineering A Materials ScienceMaterials EngineeringEutectic Sn58bi AlloyEngineeringCorrosion	2018	66

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