Cyclic twin nucleation in tin-based solder alloys

Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder

L.P. Lehman, S. N. Athavale, Travis Z. Fullem et al. · Journal of Electronic Materials · 2004 · 171 citations

Natural Sciences, Materials Engineering, Materials Science +14

Grain-boundary character and grain growth in bulk tin and bulk lead-free solder alloys

Adwait U. Telang, Thomas R. Bieler, J. P. Lucas et al. · Journal of Electronic Materials · 2004 · 134 citations

Natural Sciences, Materials Engineering, Materials Science +17

Effect of Sample Size on the Solidification Temperature and Microstructure of SnAgCu Near Eutectic Alloys

Robert Kinyanjui, L.P. Lehman, L. Zavalij et al. · Journal of materials research/Pratt's guide to venture capital sources · 2005 · 110 citations

Engineering, Materials Engineering, Materials Science +16

FURTHER OBSERVATIONS ON DENDRITIC GROWTH IN METALS

F. Weinberg, B. Chalmers · Canadian Journal of Physics · 1952 · 99 citations

Natural Sciences, Materials Engineering, Materials Science +17

Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints

Thomas R. Bieler, H. Jiang, L.P. Lehman et al. · 2006 · 86 citations

Engineering, Materials Engineering, Materials Science +17