L. Zavalij

Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder

L.P. Lehman, S. N. Athavale, Travis Z. Fullem et al. · Journal of Electronic Materials · 2004 · 170 citations

Materials Engineering, Materials Science, Intermetallic Compounds +5

The growth of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu solder/Ni interfaces and the associated evolution of the solder microstructure

A. Zribi, A. Clark, L. Zavalij et al. · Journal of Electronic Materials · 2001 · 122 citations

Materials Science, Materials Engineering, Solder Microstructure +9

Effect of Sample Size on the Solidification Temperature and Microstructure of SnAgCu Near Eutectic Alloys

Robert Kinyanjui, L.P. Lehman, L. Zavalij et al. · Journal of materials research/Pratt's guide to venture capital sources · 2005 · 110 citations

Materials Science, Materials Engineering, Engineering +12

Solder metallization interdiffusion in microelectronic interconnects

A. Zribi, Richard R. Chromik, R. Presthus et al. · IEEE Transactions on Components and Packaging Technologies · 2000 · 60 citations

Engineering, Mechanical Engineering, Solder Metallization Interdiffusion +17

Microstructure and Damage Evolution in Sn-Ag-Cu Solder Joints

L.P. Lehman, Robert Kinyanjui, Junling Wang et al. · 2005 · 33 citations

Friction Welding, Engineering, Mechanical Engineering +19