Concepedia

The growth of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu solder/Ni interfaces and the associated evolution of the solder microstructure

A. Zribi, A. Clark, L. Zavalij, E. J. Cotts

Journal of Electronic Materials · 2001 · 122 citations · 13 references

DOI

Concepts

References

13

Interdiffusion and reaction in bimetallic Cu-Sn thin films

K. N. Tu · Acta Metallurgica · 1973 · 482 citations

, , +4

A viable tin-lead solder substitute: Sn-Ag-Cu

Chad M. Miller, Iver E. Anderson, Jack Smith · Journal of Electronic Materials · 1994 · 261 citations

, , +4

Mechanical fatigue characteristics of Sn-3.5Ag-X (X=Bi, Cu, Zn and In) solder alloys

Yoshiharu Kariya, Masahisa Otsuka · Journal of Electronic Materials · 1998 · 161 citations

, , +8

Solid state intermetallic compound growth between copper and high temperature, tin-rich solders—part I: Experimental analysis

Paul T. Vianco, K.L. Erickson, P.L. Hopkins · Journal of Electronic Materials · 1994 · 129 citations

, , +9

Rate of consumption of Cu in soldering accompanied by ripening

H. K. Kim, K. N. Tu · Applied Physics Letters · 1995 · 111 citations

, , +11