Yoshiharu Kariya - Concepedia

Author

Yoshiharu Kariya

Shibaura Institute of Technology

Also Known As

Jrg, YOSHIHARU KARIYA, Yoshiharu KARIYA, Yoshiharu Kariya

139

Publications

1.4K

Citations

H-Index

Concepts

All Affiliations

Shibaura Institute of Technology National Institute for Materials Science The University of Tokyo Nippon Steel (Japan)The Open University

About

Yoshiharu Kariya is an author at Shibaura Institute of Technology specializing in engineering, materials science, and mechanical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	17	27	1.1K
2	Applied Physics	12	13	564
3	Natural Sciences	1	1	38
4	Public Health	1	1	44
5	Chemistry	1	1	38

Yoshiharu Kariya

Publications

1.2K

Citations

H-Index

Page 1

	Year	Citations
Effect of silver content on thermal fatigue life of Sn-xAg-0.5Cu flip-chip interconnects Shin‐Ichi Terashima, Yoshiharu Kariya, Takuya Hosoi, Journal of Electronic Materials Materials ScienceEngineeringSn-xag-0.5cu Flip-chip InterconnectsHardware ReliabilityAdvanced Packaging (Semiconductors)	2003	175
Mechanical fatigue characteristics of Sn-3.5Ag-X (X=Bi, Cu, Zn and In) solder alloys Yoshiharu Kariya, Masahisa Otsuka Journal of Electronic Materials Materials ScienceEngineeringSolder AlloysCorrosionMechanical Engineering	1998	161
Effect of bismuth on the isothermal fatigue properties of Sn-3.5mass%Ag solder alloy Yoshiharu Kariya, Masahisa Otsuka Journal of Electronic Materials Materials EngineeringMaterials ScienceEngineeringCorrosionMechanical Engineering	1998	96
Effect of silver content on the shear fatigue properties of Sn-Ag-Cu flip-chip interconnects Yoshiharu Kariya, Takuya Hosoi, Shin‐Ichi Terashima, Journal of Electronic Materials Materials ScienceEngineeringAdvanced Packaging (Semiconductors)Sn-ag-cu Flip-chip InterconnectsSilver Content	2004	95
Effect of thermal cycles on the mechanical strength of quad flat pack leads/Sn-3.5Ag-X (X=Bi and Cu) solder joints Yoshiharu Kariya, Yasunori Hirata, Masahisa Otsuka Journal of Electronic Materials Materials ScienceMaterials EngineeringElectrical EngineeringEngineeringMechanical Engineering	1999	66
Assessment of low-cycle fatigue life of Sn-3.5mass%Ag-X (X=Bi or Cu) alloy by strain range partitioning approach Yoshiharu Kariya, Tomoo Morihata, Eisaku Hazawa, Journal of Electronic Materials Materials ScienceMaterials EngineeringEngineeringCorrosionMechanical Engineering	2001	49
Isothermal Fatigue Properties of Sn&ndash;Ag&ndash;Cu Alloy Evaluated by Micro Size Specimen Yoshiharu Kariya, Tomokazu Niimi, Tadatomo Suga, MATERIALS TRANSACTIONS	2005	48
Tin pest in lead‐free solders Yoshiharu Kariya, Colin Gagg, W. J. Plumbridge Soldering and Surface Mount Technology Materials ScienceMaterials EngineeringLow TemperaturesEngineeringMechanical Engineering	2001	44
Infrared Emission Spectra of CaF2-CaO-SiO2 Melt. Shigeru Ueda, Hirotaka Koyo, Takashi IKEDA, ISIJ International Materials EngineeringMaterials ScienceOptical MaterialsEngineeringCaf2-cao-sio2 Melt	2000	38
Evaluation of creep properties for Sn–Ag–Cu micro solder joint by multi-temperature stress relaxation test Yoshihiko Kanda, Yoshiharu Kariya Microelectronics Reliability Materials ScienceEngineeringMechanical PropertiesMechanical EngineeringCreep Properties	2012	34

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