Concepedia

Yoshiharu Kariya

YK

Statistics

Publications

33

Citations

1.3K

H-Index

19

Active since

1998

Affiliations

Shibaura Institute of Technology(Current)

National Institute for Materials Science

The University of Tokyo

Nippon Steel (Japan)

The Open University

Yoshiharu Kariya is an author at Shibaura Institute of Technology specializing in materials engineering, materials science, and natural sciences.

Publications per year

1998–2022

33

Publications

33

Effect of silver content on thermal fatigue life of Sn-xAg-0.5Cu flip-chip interconnects

Shin‐Ichi Terashima, Yoshiharu Kariya, Takuya Hosoi et al. · Journal of Electronic Materials · 2003 · 175 citations

, , +16

Mechanical fatigue characteristics of Sn-3.5Ag-X (X=Bi, Cu, Zn and In) solder alloys

Yoshiharu Kariya, Masahisa Otsuka · Journal of Electronic Materials · 1998 · 161 citations

, , +14

Effect of bismuth on the isothermal fatigue properties of Sn-3.5mass%Ag solder alloy

Yoshiharu Kariya, Masahisa Otsuka · Journal of Electronic Materials · 1998 · 96 citations

, , +11

Effect of silver content on the shear fatigue properties of Sn-Ag-Cu flip-chip interconnects

Yoshiharu Kariya, Takuya Hosoi, Shin‐Ichi Terashima et al. · Journal of Electronic Materials · 2004 · 95 citations

, , +14

Effect of thermal cycles on the mechanical strength of quad flat pack leads/Sn-3.5Ag-X (X=Bi and Cu) solder joints

Yoshiharu Kariya, Yasunori Hirata, Masahisa Otsuka · Journal of Electronic Materials · 1999 · 66 citations

, , +17

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