Concepedia

Effect of bismuth on the isothermal fatigue properties of Sn-3.5mass%Ag solder alloy

Yoshiharu Kariya, Masahisa Otsuka

Journal of Electronic Materials · 1998 · 96 citations · 10 references

DOI

Concepts

References

10

Fatigue of 60/40 Solder

H. D. Solomon · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1986 · 300 citations

, , +17

On the Sn-Bi-Ag ternary phase diagram

Ursula R. Kattner, W. J. Boettinger · Journal of Electronic Materials · 1994 · 185 citations

, , +12

Improved mechanical properties in new, Pb-free solder alloys

M. McCormack, S. Jin · Journal of Electronic Materials · 1994 · 168 citations

, , +12

Investigation of multi-component lead-free solders

M. E. Loomans, Semyon Vaynman, Gautam Ghosh et al. · Journal of Electronic Materials · 1994 · 112 citations

, , +7

The mechanical behavior of interconnect materials for electronic packaging

D. R. Frear · JOM · 1996 · 83 citations

, , +16