Effect of silver content on thermal fatigue life of Sn-xAg-0.5Cu flip-chip interconnects

Effects of fourth alloying additive on microstructures and tensile properties of Sn–Ag–Cu alloy and joints with Cu

K.S. Kim, Seok‐Hwan Huh, Katsuaki Suganuma · Microelectronics Reliability · 2003 · 290 citations

Natural Sciences, Materials Engineering, Materials Science +11

A viable tin-lead solder substitute: Sn-Ag-Cu

Chad M. Miller, Iver E. Anderson, Jack Smith · Journal of Electronic Materials · 1994 · 261 citations

Natural Sciences, Materials Engineering, Materials Science +9

Mechanical characterization of Sn–Ag-based lead-free solders

Masazumi Amagai, Masako Watanabe, Masaki Omiya et al. · Microelectronics Reliability · 2002 · 240 citations

Natural Sciences, Materials Engineering, Materials Science +12

Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic solders

H. Mavoori, Jason Chin, Semyon Vaynman et al. · Journal of Electronic Materials · 1997 · 235 citations

Natural Sciences, Materials Engineering, Materials Science +16

The mechanical behavior of interconnect materials for electronic packaging

D. R. Frear · JOM · 1996 · 83 citations

Engineering, Materials Engineering, Materials Science +16