Effect of silver content on thermal fatigue life of Sn-xAg-0.5Cu flip-chip interconnects - Concepedia

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Effect of silver content on thermal fatigue life of Sn-xAg-0.5Cu flip-chip interconnects

175

Citations

8

References

2003

Year

Shin‐Ichi Terashima, Yoshiharu Kariya, Takuya Hosoi, Masamoto Tanaka

Journal of Electronic Materials

Materials ScienceEngineeringSn-xag-0.5cu Flip-chip InterconnectsHardware ReliabilityAdvanced Packaging (Semiconductors)Thermal Fatigue LifeSilver ContentApplied PhysicsChip On BoardChip AttachmentElectronic PackagingMicroelectronics

References

	Year	Citations

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