Concepedia

Takuya Hosoi

TH

3

Publications

286

Citations

3

H-Index

2003

Active since

Affiliations

Shibaura Institute of Technology(Current)

Nippon Steel (Japan)

National Institute for Materials Science

Takuya Hosoi is an author at Shibaura Institute of Technology specializing in engineering, applied physics, and microelectronics.

Top concepts

Publications per year

2003–2004

3

Publications

3

Effect of silver content on thermal fatigue life of Sn-xAg-0.5Cu flip-chip interconnects

Shin‐Ichi Terashima, Yoshiharu Kariya, Takuya Hosoi et al. · Journal of Electronic Materials · 2003 · 175 citations

, , +9

Effect of silver content on the shear fatigue properties of Sn-Ag-Cu flip-chip interconnects

Yoshiharu Kariya, Takuya Hosoi, Shin‐Ichi Terashima et al. · Journal of Electronic Materials · 2004 · 95 citations

, , +11

Low Cycle Fatigue Properties of Ni added Low Silver Content Sn-Ag-Cu Flip Chip Interconnects

Yoshiharu Kariya, Takuya Hosoi, Takashi Kimura et al. · MATERIALS TRANSACTIONS · 2004 · 16 citations · Full text

, , +16

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