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Effect of silver content on the shear fatigue properties of Sn-Ag-Cu flip-chip interconnects

Materials ScienceEngineeringAdvanced Packaging (Semiconductors)Sn-ag-cu Flip-chip InterconnectsSilver ContentMechanical EngineeringApplied PhysicsShear Fatigue PropertiesChip AttachmentElectronic PackagingMicroelectronicsLow-cycle FatigueMechanics Of MaterialsInterconnect (Integrated Circuits)