Journal of Electronic Materials · 2004 · 95 citations · 14 references
Natural SciencesMaterials EngineeringMaterials ScienceMaterials CharacterizationMechanical Behavior Of MaterialsMetallic MaterialsFatigueFracture ToughnessInterconnect TechnologyMetalsShear PropertiesShear StrengthCopper InterconnectsFlip-chip BondingInterconnect CharacterizationOn-chip InterconnectsShear Fatigue
14
Pb-free solders for flip-chip interconnects
D. R. Frear, Jihun Jang, J. K. Lin et al. · JOM · 2001 · 317 citations
Engineering, Electrical Engineering, Materials Engineering +14
J. Wayne Meredith · 2003 · 297 citations
Engineering, Electrical Engineering, Manufacturing Engineering +13