Masamoto Tanaka

Effect of silver content on thermal fatigue life of Sn-xAg-0.5Cu flip-chip interconnects

Shin‐Ichi Terashima, Yoshiharu Kariya, Takuya Hosoi et al. · Journal of Electronic Materials · 2003 · 175 citations

Materials Science, Engineering, Sn-xag-0.5cu Flip-chip Interconnects +9

Processing and properties of QMG materials

Mitsuru Morita, M. Sawamura, S. Takebayashi et al. · Physica C Superconductivity · 1994 · 130 citations

Materials Science, Materials Engineering, Engineering +6

High Magnetic Flux Trapping by Melt-Grown YBaCuO Superconductors

Kiyoshi Sawano, Mitsuru Morita, Masamoto Tanaka et al. · Japanese Journal of Applied Physics · 1991 · 107 citations

Superconducting Material, Magnetic Properties, Engineering +18

Effect of Pt Addition on Melt-Processed YBaCuO Superconductors

Mitsuru Morita, Masamoto Tanaka, Seiki Takebayashi et al. · Japanese Journal of Applied Physics · 1991 · 103 citations

Materials Science, Superconducting Material, High-tc Superconductivity +14

Effect of silver content on the shear fatigue properties of Sn-Ag-Cu flip-chip interconnects

Yoshiharu Kariya, Takuya Hosoi, Shin‐Ichi Terashima et al. · Journal of Electronic Materials · 2004 · 95 citations

Materials Science, Engineering, Advanced Packaging (Semiconductors) +11