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Effect of thermal cycles on the mechanical strength of quad flat pack leads/Sn-3.5Ag-X (X=Bi and Cu) solder joints

Materials ScienceMaterials EngineeringElectrical EngineeringEngineeringMechanical EngineeringMechanical StrengthThermal CyclesChip AttachmentSolder JointsElectronic PackagingMechanics Of Materials