Effect of thermal cycles on the mechanical strength of quad flat pack leads/Sn-3.5Ag-X (X=Bi and Cu) solder joints

A viable tin-lead solder substitute: Sn-Ag-Cu

Chad M. Miller, Iver E. Anderson, Jack Smith · Journal of Electronic Materials · 1994 · 261 citations

Natural Sciences, Materials Engineering, Materials Science +9

Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic solders

H. Mavoori, Jason Chin, Semyon Vaynman et al. · Journal of Electronic Materials · 1997 · 235 citations

Natural Sciences, Materials Engineering, Materials Science +16

On the Sn-Bi-Ag ternary phase diagram

Ursula R. Kattner, W. J. Boettinger · Journal of Electronic Materials · 1994 · 185 citations

Natural Sciences, Materials Engineering, Materials Science +12

Improved mechanical properties in new, Pb-free solder alloys

M. McCormack, S. Jin · Journal of Electronic Materials · 1994 · 168 citations

Natural Sciences, Materials Engineering, Materials Science +12

New, lead-free solders

M. McCormack, S. Jin · Journal of Electronic Materials · 1994 · 168 citations