Robert Kinyanjui

Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder

L.P. Lehman, S. N. Athavale, Travis Z. Fullem et al. · Journal of Electronic Materials · 2004 · 170 citations

Materials Engineering, Materials Science, Intermetallic Compounds +5

Effect of Sample Size on the Solidification Temperature and Microstructure of SnAgCu Near Eutectic Alloys

Robert Kinyanjui, L.P. Lehman, L. Zavalij et al. · Journal of materials research/Pratt's guide to venture capital sources · 2005 · 110 citations

Materials Science, Materials Engineering, Engineering +12

Microstructure and Damage Evolution in Sn-Ag-Cu Solder Joints

L.P. Lehman, Robert Kinyanjui, Junling Wang et al. · 2005 · 33 citations

Friction Welding, Engineering, Mechanical Engineering +19

Aspects of the structural evolution of lead-free solder joints

A. Zribi, Robert Kinyanjui, L. Zavalij et al. · JOM · 2002 · 15 citations

Materials Science, Friction Welding, Engineering +6

Growth and selection of intermetallic species in Sn-Ag-Cu No-Pb solder systems based on pad metallurgies and thermal histories

L.P. Lehman, Robert Kinyanjui, L. Zavalij et al. · 2004 · 14 citations

Materials Science, Materials Engineering, Engineering +15