A review: Formation of voids in solder joint during the transient liquid phase bonding process - Causes and solutions

Diffusional Viscosity of a Polycrystalline Solid

Conyers Herring · Journal of Applied Physics · 1950 · 2.5K citations

Engineering, Materials Engineering, Materials Science +17

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

Ke Zeng, K. N. Tu · Materials Science and Engineering R Reports · 2002 · 1.4K citations

Engineering, Materials Engineering, Materials Science +15

Hot-isostatic pressing diagrams: New developments

Aino Helle, K. E. Easterling, Michael F. Ashby · Acta Metallurgica · 1985 · 711 citations

Natural Sciences, Materials Engineering, Materials Science +6

Overview of transient liquid phase and partial transient liquid phase bonding

Grant O. Cook, Carl D. Sorensen · Journal of Materials Science · 2011 · 462 citations · Full text

Engineering, Materials Engineering, Materials Science +16

Diffusion Models for Hot Pressing with Surface Energy and Pressure Effects as Driving Forces

R. L. Coble · Journal of Applied Physics · 1970 · 414 citations

Engineering, Materials Engineering, Materials Science +17