Comparison of interfacial reactions of Ni and Ni–P in extended contact with liquid Sn–Bi-based solders

Fractal character of fracture surfaces of metals

Benoît B. Mandelbrot, D. E. Passoja, Alvin J. Paullay · Nature · 1984 · 1.9K citations

Natural Sciences, Materials Engineering, Materials Science +14

Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening

H. K. Kim, K. N. Tu · Physical review. B, Condensed matter · 1996 · 501 citations

Engineering, Materials Engineering, Materials Science +14

Theory for intermetallic phase growth between cu and liquid Sn-Pb solder based on grain boundary diffusion control

Matt Schaefer, R.A. Fournelle, Jin Liang · Journal of Electronic Materials · 1998 · 327 citations

Natural Sciences, Materials Engineering, Materials Science +14

Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology

Jihun Jang, P. G. Kim, K. N. Tu et al. · Journal of Applied Physics · 1999 · 283 citations

Natural Sciences, Materials Engineering, Materials Science +17

Prediction of interface reaction products between Cu and various solder alloys by thermodynamic calculation

Byeong‐Joo Lee, Nong‐Moon Hwang, Hyuck Mo Lee · Acta Materialia · 1997 · 268 citations

Natural Sciences, Materials Engineering, Materials Science +16