K. N. Tu - Concepedia

Author

K. N. Tu

University of California, Los Angeles

Also Known As

K. N. Tu, King-Ning Tu

Publications

Citations

H-Index

Concepts

All Affiliations

University of California, Los Angeles Hodges University Semiconductor Manufacturing International (Italy)Nanyang Technological University National Yang Ming Chiao Tung University

About

K. N. Tu is an author at University of California, Los Angeles specializing in applied physics, engineering, and electronic packaging.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	8	8	973
2	Applied Physics	8	8	973
3	Electrical Engineering	7	7	472
4	Materials Engineering	3	3	580
5	Chemistry	1	1	501

K. N. Tu

Publications

Citations

H-Index

Page 1

	Year	Citations
Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening H. K. Kim, K. N. Tu Physical review. B, Condensed matter EngineeringMechanical EngineeringChemistryEutectic Snpb AlloyMolten Solder	1996	501
Electromigration of eutectic SnPb solder interconnects for flip chip technology T. Y. Lee, K. N. Tu, S.-M. Kuo, Journal of Applied Physics Materials ScienceAdvanced PackagingElectrical EngineeringFlip Chip TechnologyEngineering	2001	181
<i>In situ</i> observation of electromigration-induced void migration in dual-damascene Cu interconnect structures A. V. Vairagar, Subodh G. Mhaisalkar, Ahila Krishnamoorthy, Applied Physics Letters Materials ScienceElectrical EngineeringElectromigration TechniqueEngineeringPhysics	2004	107
Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigration Shuqi Liang, Yuan Chang, T. L. Shao, Applied Physics Letters EngineeringFlip-chip Solder JointsVoid GrowthTemperature DistributionsInterconnect (Integrated Circuits)	2006	58
Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu Jing-Ye Juang, Chia-Ling Lu, Yu-Jin Li, Materials	2018	48
Microstructural evolution and atomic transport by thermomigration in eutectic tin-lead flip chip solder joints Dan Yang, Bin Wu, Y.C. Chan, Journal of Applied Physics EngineeringThermomigration BehaviorInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors)Microstructural Evolution	2007	40
Three-dimensional simulation of void migration at the interface between thin metallic film and dielectric under electromigration T. V. Zaporozhets, Andriy Gusak, K. N. Tu, Journal of Applied Physics EngineeringVoid MigrationDielectric OverlayerNanoelectronicsNanoscale Modeling	2005	38
Joule heating induced thermomigration failure in un-powered microbumps due to thermal crosstalk in 2.5D IC technology Menglu Li, Dongwook Kim, Sam Gu, Journal of Applied Physics EngineeringLiquid Metal CoolingSi ChipIntegrated CircuitsJoule Heating	2016	27
Direct evidence of Cu/cap/liner edge being the dominant electromigration path in dual damascene Cu interconnects Wei Shao, Subodh G. Mhaisalkar, Thirumany Sritharan, Applied Physics Letters EngineeringCu/cap/liner EdgeInterconnect (Integrated Circuits)Direct EvidenceElectronic Packaging	2007	21
Quaternary low melting point Sn-Bi-in-xGa solder with improved mechanical performance for advanced electronic packaging Jingyu Qiao, Xingchao Mao, Lulin Xie, Intermetallics	2024	10

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