Concepedia

K. N. Tu

KN

10

Publications

1K

Citations

10

H-Index

1996

Active since

Affiliations

University of California, Los Angeles(Current)

Hodges University

Semiconductor Manufacturing International (Italy)

Nanyang Technological University

National Yang Ming Chiao Tung University

K. N. Tu is an author at University of California, Los Angeles specializing in applied physics, engineering, and electronic packaging.

Top concepts

EngineeringApplied PhysicsMaterial ScienceMicroelectronicsElectronic PackagingElectrical EngineeringElectrical InsulationSurface SciencePhysicsMicrostructure

Publications per year

1996–2024

10

Publications

10

Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening

H. K. Kim, K. N. Tu · Physical review. B, Condensed matter · 1996 · 501 citations

Engineering, Mechanical Engineering, Chemistry +17

Electromigration of eutectic SnPb solder interconnects for flip chip technology

T. Y. Lee, K. N. Tu, S.-M. Kuo et al. · Journal of Applied Physics · 2001 · 181 citations

Materials Science, Advanced Packaging, Electrical Engineering +15

<i>In situ</i> observation of electromigration-induced void migration in dual-damascene Cu interconnect structures

A. V. Vairagar, Subodh G. Mhaisalkar, Ahila Krishnamoorthy et al. · Applied Physics Letters · 2004 · 107 citations

Materials Science, Electrical Engineering, Electromigration Technique +15

Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigration

Shuqi Liang, Yuan Chang, T. L. Shao et al. · Applied Physics Letters · 2006 · 58 citations

Engineering, Flip-chip Solder Joints, Void Growth +18

Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu

Jing-Ye Juang, Chia-Ling Lu, Yu-Jin Li et al. · Materials · 2018 · 48 citations · Full text

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