A. V. Vairagar

<i>In situ</i> observation of electromigration-induced void migration in dual-damascene Cu interconnect structures

A. V. Vairagar, Subodh G. Mhaisalkar, Ahila Krishnamoorthy et al. · Applied Physics Letters · 2004 · 107 citations

Materials Science, Electrical Engineering, Electromigration Technique +15

Electromigration behavior of dual-damascene Cu interconnects––Structure, width, and length dependences

A. V. Vairagar, Subodh G. Mhaisalkar, Ahila Krishnamoorthy · Microelectronics Reliability · 2004 · 77 citations

Materials Science, Electrical Engineering, Electromigration Technique +5

Current crowding effect on copper dual damascene via bottom failure for ULSI applications

Cher Ming Tan, Arijit Roy, A. V. Vairagar et al. · IEEE Transactions on Device and Materials Reliability · 2005 · 57 citations · Full text

Engineering, Severe Plastic Deformation, Chemical Deposition +19

Direct evidence of electromigration failure mechanism in dual-damascene Cu interconnect tree structures

A. V. Vairagar, Subodh G. Mhaisalkar, Michael Meyer et al. · Applied Physics Letters · 2005 · 33 citations

Materials Science, Electrical Engineering, Electromigration Technique +14

Effect of surface treatment on electromigration in sub-micron Cu damascene interconnects

A. V. Vairagar, Subodh G. Mhaisalkar, Ahila Krishnamoorthy · Thin Solid Films · 2004 · 31 citations

Materials Science, Electrical Engineering, Electromigration Technique +9