Concepedia

Arijit Roy

AR

Statistics

Publications

11

Citations

564

H-Index

10

Active since

2005

Affiliations

Nanyang Technological University(Current)

Institute of Microelectronics

West Bengal State University

Singapore Science Park

Arijit Roy is an author at Nanyang Technological University specializing in electronic packaging, electrical engineering, and applied physics.

Top concepts

EngineeringApplied PhysicsMicroelectronicsElectronic PackagingElectrical EngineeringNanoelectronicsElectrical InsulationMaterial ScienceMaterials EngineeringPhysics

Publications per year

2005–2021

11

Publications

11

Electromigration in ULSI interconnects

Cher Ming Tan, Arijit Roy · Materials Science and Engineering R Reports · 2007 · 238 citations

Electrical Engineering, Electromigration Technique, Engineering +6

Investigation of the effect of temperature and stress gradients on accelerated EM test for Cu narrow interconnects

Cher Ming Tan, Arijit Roy · Thin Solid Films · 2005 · 75 citations

Electrical Engineering, Electromigration Technique, Engineering +9

Current crowding effect on copper dual damascene via bottom failure for ULSI applications

Cher Ming Tan, Arijit Roy, A. V. Vairagar et al. · IEEE Transactions on Device and Materials Reliability · 2005 · 57 citations · Full text

Engineering, Severe Plastic Deformation, Chemical Deposition +19

Very high current density package level electromigration test for copper interconnects

Arijit Roy, Cher Ming Tan · Journal of Applied Physics · 2008 · 34 citations

Advanced Packaging, Quantitative Analyses, Electrical Engineering +15

Probing into the asymmetric nature of electromigration performance of submicron interconnect via structure

Arijit Roy, Cher Ming Tan · Thin Solid Films · 2006 · 31 citations

Electrical Engineering, Electromigration Technique, Engineering +11

Rows per page

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