Ahila Krishnamoorthy

Self-assembled near-zero-thickness molecular layers as diffusion barriers for Cu metallization

Ahila Krishnamoorthy, K. Chanda, S. P. Murarka et al. · Applied Physics Letters · 2001 · 114 citations

Sam-coated Capacitors, Engineering, Surface Nanotechnology +19

<i>In situ</i> observation of electromigration-induced void migration in dual-damascene Cu interconnect structures

A. V. Vairagar, Subodh G. Mhaisalkar, Ahila Krishnamoorthy et al. · Applied Physics Letters · 2004 · 107 citations

Materials Science, Electrical Engineering, Electromigration Technique +15

Electromigration behavior of dual-damascene Cu interconnects––Structure, width, and length dependences

A. V. Vairagar, Subodh G. Mhaisalkar, Ahila Krishnamoorthy · Microelectronics Reliability · 2004 · 77 citations

Materials Science, Electrical Engineering, Electromigration Technique +5

Investigation of electrical conduction in carbon-doped silicon oxide using a voltage ramp method

Kok-Yong Yiang, Won Jong Yoo, Qiang Guo et al. · Applied Physics Letters · 2003 · 62 citations · Full text

Semiconductors, Electrical Conduction, Electrical Engineering +15

Current crowding effect on copper dual damascene via bottom failure for ULSI applications

Cher Ming Tan, Arijit Roy, A. V. Vairagar et al. · IEEE Transactions on Device and Materials Reliability · 2005 · 57 citations · Full text

Engineering, Severe Plastic Deformation, Chemical Deposition +19