Concepedia

Shuqi Liang

SL

Statistics

Publications

18

Citations

465

H-Index

13

Active since

2003

Affiliations

National Yang Ming Chiao Tung University(Current)

Sichuan University

Nanjing Hydraulic Research Institute

State Key Laboratory of Hydraulics and Mountain River Engineering

Yalong Hydro (China)

Shuqi Liang is an author at National Yang Ming Chiao Tung University specializing in materials science, electronic materials, and engineering.

Publications per year

2003–2025

18

Publications

18

Electromigration issues in lead-free solder joints

Chih Chen, Shuqi Liang · Journal of Materials Science Materials in Electronics · 2006 · 95 citations

Natural Sciences, Materials Engineering, Materials Science +9

Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigration

Shuqi Liang, Yuan Chang, T. L. Shao et al. · Applied Physics Letters · 2006 · 58 citations

Engineering, Electrical Engineering, Materials Science +17

Effect of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints under accelerated electromigration

Shuqi Liang, Yuan-Hao Chang, Chih Chen · Applied Physics Letters · 2006 · 48 citations

Engineering, Electrical Engineering, Materials Science +16

Relieving the current crowding effect in flip-chip solder joints during current stressing

Shuqi Liang, T. L. Shao, Chih Chen et al. · Journal of materials research/Pratt's guide to venture capital sources · 2006 · 27 citations

Engineering, Electrical Engineering, Materials Science +11

Relieving Hot-Spot Temperature and Current Crowding Effects During Electromigration in Solder Bumps by Using Cu Columns

Shuqi Liang, Chih Chen · Journal of Electronic Materials · 2007 · 24 citations

Engineering, Electrical Engineering, Materials Engineering +15

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