Relieving Hot-Spot Temperature and Current Crowding Effects During Electromigration in Solder Bumps by Using Cu Columns

Electromigration—A brief survey and some recent results

J. R. Black · IEEE Transactions on Electron Devices · 1969 · 1.5K citations

Engineering, Electrical Engineering, Materials Science +17

Recent advances on electromigration in very-large-scale-integration of interconnects

K. N. Tu · Journal of Applied Physics · 2003 · 1.1K citations

Engineering, Electrical Engineering, Materials Science +17

Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization

Woon‐Seop Choi, Everett C. C. Yeh, K. N. Tu · Journal of Applied Physics · 2003 · 232 citations

Engineering, Electrical Engineering, Materials Science +17

Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes

C. Y. Liu, Chih Chen, Chien‐Neng Liao et al. · Applied Physics Letters · 1999 · 160 citations

Engineering, Electrical Engineering, Materials Engineering +14

Thermomigration in SnPb composite flip chip solder joints

Annie T. Huang, Andriy Gusak, K. N. Tu et al. · Applied Physics Letters · 2006 · 159 citations

Engineering, Materials Engineering, Materials Science +15