Electromigration

Electromigration is a phenomenon in semiconductor reliability and interconnect technology wherein the gradual displacement of metal atoms in a conductor occurs due to the momentum transfer from migrating electrons under high current density, leading to the formation of voids and hillocks that degrade device performance over time.

2.2K

Publications

88.4K

Citations

5.1K

Authors

946

Institutions

Publications per year

2017–2026

246

Authors

5.1K

  1. CC
    Chih Chen

    National Yang Ming Chiao Tung University, Taiwan

    41 publications · 2.2K citations

    27

    h-index

  2. CV
    Carl V. Thompson

    Massachusetts Institute of Technology, United States

    43 publications · 1.9K citations

    26

    h-index

  3. PS
    Paul S. Ho

    The University of Texas at Austin, United States

    54 publications · 2.5K citations

    25

    h-index

  4. KN
    K. N. Tu

    University of California, Los Angeles, United States

    38 publications · 2.6K citations

    25

    h-index

  5. JR
    J. R. Lloyd

    IBM (United States), United States

    36 publications · 2.4K citations

    23

    h-index

1–5 of 5.1K

Venues

  1. Journal of Applied Physics

    268 publications · 15.3K citations

    63

    h-index

  2. Applied Physics Letters

    179 publications · 9.7K citations

    57

    h-index

  3. Microelectronics Reliability

    69 publications · 2.7K citations

    28

    h-index

  4. IEEE Transactions on Electron Devices

    53 publications · 4.6K citations

    28

    h-index

  5. Journal of Electronic Materials

    JEM · 69 publications · 1.9K citations

    25

    h-index

1–5