Annie T. Huang

Thermomigration in SnPb composite flip chip solder joints

Annie T. Huang, Andriy Gusak, K. N. Tu et al. · Applied Physics Letters · 2006 · 159 citations

Engineering, Materials Engineering, Materials Science +15

Effect of the combination of electromigration and thermomigration on phase migration and partial melting in flip chip composite SnPb solder joints

Annie T. Huang, K. N. Tu, Yi-Shao Lai · Journal of Applied Physics · 2006 · 49 citations

Engineering, Electrical Engineering, Materials Engineering +16

Influence of Cu column under-bump-metallizations on current crowding and Joule heating effects of electromigration in flip-chip solder joints

Yingqi Liang, W. A. Tsao, Chih Chen et al. · Journal of Applied Physics · 2012 · 27 citations

Engineering, Materials Engineering, Materials Science +17

Molecular-weight-dependent nanoscale morphology in silole-containing cyclopentadithiophene polymer and fullerene derivative blends

Jen-Hsien Huang, Fang‐Chung Chen, Cheng‐Lun Chen et al. · Organic Electronics · 2011 · 23 citations

Natural Sciences, Chemistry, Materials Science +15

Achieving a foldable and durable <scp>OLED</scp> display with <scp>BT</scp>.2020 color space using innovative color filter structure

Meng‐Ting Lee, Chengliang Wang, Chi‐Shun Chan et al. · Journal of the Society for Information Display · 2017 · 22 citations

Engineering, Design, Electronic Materials +12