Yi-Shao Lai

Thermomigration in SnPb composite flip chip solder joints

Annie T. Huang, Andriy Gusak, K. N. Tu et al. · Applied Physics Letters · 2006 · 159 citations

Engineering, Composite Solder Joint, Advanced Packaging (Semiconductors) +16

Effect of entropy production on microstructure change in eutectic SnPb flip chip solder joints by thermomigration

Fan-Yi Ouyang, K. N. Tu, Yi-Shao Lai et al. · Applied Physics Letters · 2006 · 60 citations

Engineering, Lamellar Microstructure, Advanced Packaging (Semiconductors) +20

Nanomechanical responses of intermetallic phase at the solder joint interface – Crystal orientation and metallurgical effects

Jenn‐Ming Song, Bo-Ron Huang, Cheng‐Yi Liu et al. · Materials Science and Engineering A · 2011 · 57 citations

Materials Science, Interface Property, Engineering +13

Cross-sectional transmission electron microscopy observations on the Berkovich indentation-induced deformation microstructures in GaN thin films

Chi-Hui Chien, Sheng‐Rui Jian, Chung-Ting Wang et al. · Journal of Physics D Applied Physics · 2007 · 53 citations

Materials Science, Wide-bandgap Semiconductor, Epitaxial Growth +14

Electromigration induced high fraction of compound formation in SnAgCu flip chip solder joints with copper column

Luhua Xu, Jung‐Kyu Han, Jarrett Jun Liang et al. · Applied Physics Letters · 2008 · 50 citations

Engineering, Mechanical Engineering, Interconnect (Integrated Circuits) +18