Yi-Shao Lai - Concepedia

Author

Yi-Shao Lai

Advanced Semiconductor Engineering (Taiwan)

Also Known As

Yi-Shao Lai

Publications

951

Citations

H-Index

Concepts

All Affiliations

Advanced Semiconductor Engineering (Taiwan)National Yang Ming Chiao Tung University Hodges University Semiconductor Manufacturing International (Italy)University of California, Los Angeles

About

Yi-Shao Lai is an author at Advanced Semiconductor Engineering (Taiwan) specializing in engineering, materials science, and applied physics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	19	26	853
2	Applied Physics	16	17	676
3	Electrical Engineering	9	9	244
4	Computer Engineering	2	2	30
5	Civil Engineering	1	1	17

Yi-Shao Lai

Publications

904

Citations

H-Index

Page 1

	Year	Citations
Thermomigration in SnPb composite flip chip solder joints Annie T. Huang, Andriy Gusak, K. N. Tu, Applied Physics Letters EngineeringComposite Solder JointAdvanced Packaging (Semiconductors)Thermal AnalysisThermodynamics	2006	159
Effect of entropy production on microstructure change in eutectic SnPb flip chip solder joints by thermomigration Fan-Yi Ouyang, K. N. Tu, Yi-Shao Lai, Applied Physics Letters EngineeringLamellar MicrostructureAdvanced Packaging (Semiconductors)Transport PhenomenaThermodynamics	2006	60
Nanomechanical responses of intermetallic phase at the solder joint interface – Crystal orientation and metallurgical effects Jenn‐Ming Song, Bo-Ron Huang, Cheng‐Yi Liu, Materials Science and Engineering A Materials ScienceInterface PropertyEngineeringMechanical PropertiesMechanical Engineering	2011	57
Cross-sectional transmission electron microscopy observations on the Berkovich indentation-induced deformation microstructures in GaN thin films Chi-Hui Chien, Sheng‐Rui Jian, Chung-Ting Wang, Journal of Physics D Applied Physics Materials ScienceWide-bandgap SemiconductorEpitaxial GrowthEngineeringSevere Plastic Deformation	2007	53
Electromigration induced high fraction of compound formation in SnAgCu flip chip solder joints with copper column Luhua Xu, Jung‐Kyu Han, Jarrett Jun Liang, Applied Physics Letters EngineeringMechanical EngineeringInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors)Corrosion	2008	50
Effect of the combination of electromigration and thermomigration on phase migration and partial melting in flip chip composite SnPb solder joints Annie T. Huang, K. N. Tu, Yi-Shao Lai Journal of Applied Physics EngineeringMechanical EngineeringLocalized Hot SpotAdvanced Packaging (Semiconductors)Partial Melting	2006	49
Cross-sectional transmission electron microscopy observations of structural damage in Al0.16Ga0.84N thin film under contact loading Sheng‐Rui Jian, Jenh‐Yih Juang, Yi-Shao Lai Journal of Applied Physics Aluminium NitrideEngineeringSevere Plastic DeformationMechanical EngineeringMicrostructure-strength Relationship	2008	36
Mechanical properties of the hexagonal HoMnO3 thin films by nanoindentation Cheng-Yo Yen, Sheng‐Rui Jian, Yi-Shao Lai, Journal of Alloys and Compounds Materials ScienceMaterial AnalysisEngineeringMechanical PropertiesNanotechnology	2010	31
Nanomechanical properties of AlN(103) thin films by nanoindentation Sheng‐Rui Jian, Guo-Ju Chen, J.S.C. Jang, Journal of Alloys and Compounds Materials ScienceAluminium NitrideEngineeringApplied PhysicsThin Films	2009	29
Influence of Cu column under-bump-metallizations on current crowding and Joule heating effects of electromigration in flip-chip solder joints Yingqi Liang, W. A. Tsao, Chih Chen, Journal of Applied Physics EngineeringFlip-chip Solder JointsSnag Solder BumpsInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors)	2012	27

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