Jarrett Jun Liang

Statistics

Publications

Citations

H-Index

Active since

2008

Affiliations

University of California, Los Angeles(Current)

Jarrett Jun Liang is an author at University of California, Los Angeles specializing in mechanical engineering, electronic packaging, and engineering.

Top concepts

EngineeringMaterial ScienceMicroelectronicsElectronic PackagingElectrical EngineeringMechanical EngineeringCorrosionHeat TransferMicrostructureSurface Science

Publications per year

2008–2009

Publications

Electromigration induced high fraction of compound formation in SnAgCu flip chip solder joints with copper column

Luhua Xu, Jung‐Kyu Han, Jarrett Jun Liang et al. · Applied Physics Letters · 2008 · 50 citations

Engineering, Mechanical Engineering, Interconnect (Integrated Circuits) +18

Electromigration failure with thermal gradient effect in SnAgCu solder joints with various UBM

Luhua Xu, Shujie Liang, Di Xu et al. · 2009 · 12 citations

Engineering, Flip Chip Package, Mechanical Engineering +18

1–2 of 2