Concepedia

Shujie Liang

SL

Statistics

Publications

4

Citations

57

H-Index

4

Active since

2006

Affiliations

National Yang Ming Chiao Tung University(Current)

University of California, Los Angeles

Shujie Liang is an author at National Yang Ming Chiao Tung University specializing in materials engineering, materials science, and engineering.

Top concepts

EngineeringMaterial ScienceMaterials EngineeringMicrostructureMicroelectronicsElectronic PackagingElectrical EngineeringApplied PhysicsMechanical EngineeringCorrosion

Publications per year

2006–2021

4

Publications

4

Effect of pure iron interlayer on microstructure and properties of hot-rolled stainless steel clad plate

Chao Yu, Zejun Deng, Shujie Liang et al. · Materials Today Communications · 2021 · 19 citations

Materials Science, Materials Engineering, Engineering +9

Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration

Shujie Liang, Chih Chen, Jung-Kyu Han et al. · Journal of Applied Physics · 2010 · 14 citations

Engineering, Severe Plastic Deformation, Whisker Growth +17

Redistribution of Pb-rich phase during electromigration in eutectic SnPb solder stripes

C. K. Chou, C. A. Chen, Shujie Liang et al. · Journal of Applied Physics · 2006 · 12 citations

Materials Engineering, Materials Science, Electrical Engineering +15

Electromigration failure with thermal gradient effect in SnAgCu solder joints with various UBM

Luhua Xu, Shujie Liang, Di Xu et al. · 2009 · 12 citations

Engineering, Flip Chip Package, Mechanical Engineering +18

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