Chih Chen

Statistics

Publications

Citations

213

H-Index

Active since

2006

Affiliations

National Yang Ming Chiao Tung University(Current)

Taiwan Semiconductor Manufacturing Company (Taiwan)

Chih Chen is an author at National Yang Ming Chiao Tung University specializing in electromigration, materials science, and electromigration analysis.

Publications per year

2006–2019

Publications

Electromigration issues in lead-free solder joints

Chih Chen, Shuqi Liang · Journal of Materials Science Materials in Electronics · 2006 · 95 citations

Natural Sciences, Materials Engineering, Materials Science +9

Precipitation of large Ag3Sn intermetallic compounds in SnAg2.5 microbumps after multiple reflows in 3D-IC packaging

Ruo-Wei Yang, Yuan-Wei Chang, Wei-Chi Sung et al. · Materials Chemistry and Physics · 2012 · 25 citations

Natural Sciences, Materials Engineering, Materials Science +3

Electromigration immortality of purely intermetallic micro -bump for 3D integration

Hsiao-Yun Chen, Chih‐Hang Tung, Jyun-Lin Wu et al. · 2015 · 24 citations

Engineering, Electrical Engineering, Materials Science +14

Generic rules to achieve bump electromigration immortality for 3D IC integration

Hsiao-Yun Chen, Da‐Yuan Shih, Cheng-Chang Wei et al. · 2013 · 20 citations

Engineering, Electrical Engineering, Materials Science +17

Roles of Additives in Damascene Copper Electropolishing

Sue-Hong Liu, Jia‐Min Shieh, Chih Chen et al. · Journal of The Electrochemical Society · 2006 · 19 citations

Natural Sciences, Chemical Engineering, Chemistry +17

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