S.-M. Kuo

Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu

T. Y. Lee, Woon‐Seop Choi, K. N. Tu et al. · Journal of materials research/Pratt's guide to venture capital sources · 2002 · 252 citations

Materials Science, Engineering, Pb-free Solders +8

Electromigration of eutectic SnPb solder interconnects for flip chip technology

T. Y. Lee, K. N. Tu, S.-M. Kuo et al. · Journal of Applied Physics · 2001 · 181 citations

Materials Science, Advanced Packaging, Electrical Engineering +15

A system for systematically preparing atom-probe field-ion-microscope specimens for the study of internal interfaces

Bruce W. Krakauer, Juanrui Hu, S.-M. Kuo et al. · Review of Scientific Instruments · 1990 · 85 citations

Engineering, Microscopy, High Voltage Electrical Fields +20

Sliding behavior of aluminum

S.-M. Kuo, D.A. Rigney · Materials Science and Engineering A · 1992 · 84 citations

Materials Science, Engineering, Slide Dynamic +6

Deformation substructures associated with very large plastic strains

D.A. Rigney, R. Divakar, S.-M. Kuo · Scripta Metallurgica et Materialia · 1992 · 49 citations

Materials Science, Engineering, Severe Plastic Deformation +8