S.-M. Kuo - Concepedia

Author

S.-M. Kuo

Motorola (United States)ORCID

Also Known As

S. M. Kuo, S.-M. KUO, S.-M. Kuo, S.M Kuo, S.M. Kuo, Shih-An Kuo, Shun Meen Kuo

Publications

892

Citations

H-Index

Concepts

All Affiliations

Motorola (United States)Northwestern University University of California, Los Angeles The Ohio State University Medtronic (United States)

About

S.-M. Kuo is an author at Motorola (United States) specializing in engineering, materials science, and applied physics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	12	12	856
2	Applied Physics	6	6	600
3	Chemistry	2	2	297
4	Computer Engineering	2	2	60
5	Natural Sciences	1	1	45

S.-M. Kuo

Publications

870

Citations

H-Index

Page 1

	Year	Citations
Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu T. Y. Lee, Woon‐Seop Choi, K. N. Tu, Journal of materials research/Pratt's guide to venture capital sources Materials ScienceEngineeringPb-free SoldersApplied PhysicsMetallurgical Interaction	2002	252
Electromigration of eutectic SnPb solder interconnects for flip chip technology T. Y. Lee, K. N. Tu, S.-M. Kuo, Journal of Applied Physics Materials ScienceAdvanced PackagingElectrical EngineeringFlip Chip TechnologyEngineering	2001	181
A system for systematically preparing atom-probe field-ion-microscope specimens for the study of internal interfaces Bruce W. Krakauer, Juanrui Hu, S.-M. Kuo, Review of Scientific Instruments EngineeringMicroscopyHigh Voltage Electrical FieldsAtom-probe Field-ion-microscope SpecimensElectron Microscopy	1990	85
Sliding behavior of aluminum S.-M. Kuo, D.A. Rigney Materials Science and Engineering A Materials ScienceEngineeringSlide DynamicSevere Plastic DeformationMechanical Engineering	1992	84
Deformation substructures associated with very large plastic strains D.A. Rigney, R. Divakar, S.-M. Kuo Scripta Metallurgica et Materialia Materials ScienceEngineeringSevere Plastic DeformationMechanical EngineeringLarge Plastic Strains	1992	49
Solute-atom segregation: An oscillatory Ni profile at an internal interface in Pt(Ni) S.-M. Kuo, A. Seki, Y. Oh, Physical Review Letters EngineeringComputational ChemistryChemistryInterface ChemistryIndividual Grain Boundary	1990	45
A low cost, high performance optical interconnect Daniel Schwartz, C.K.Y. Chun, B. Foley, Optical MaterialsEngineeringFiber OpticsAggregate ThroughputFiber-optic Communication	2002	40
Mechanics-Based Solutions to RF MEMS Switch Stiction Problem L.L. Mercado, S.-M. Kuo, T.-Y.T. Lee, IEEE Transactions on Components and Packaging Technologies EngineeringMems SwitchesMechanical EngineeringElectrostatic ForceMechatronic System	2004	36
Analysis of RF MEMS switch packaging Process for yield improvement L.L. Mercado, S.-M. Kuo, Tien-Yu Lee, IEEE Transactions on Advanced Packaging EngineeringMechanical EngineeringMicroelectromechanical SystemsMicro-electromechanical SystemElectromagnetic Compatibility	2005	27
Further statistical analysis of the composition of a grain boundary in a Mo(Re) alloy studied by atom-probe field-ion microscopy D. Udler, Jinglin Hu, S.-M. Kuo, Scripta Metallurgica et Materialia Materials ScienceEngineeringElectron MicroscopyPhysicsGrain Boundary	1991	24

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