Publication | Open Access
Novel approach to copper sintering using surface enhanced brass micro flakes for microelectronics packaging
46
Citations
25
References
2020
Year
Materials ScienceSinteringPowder MetallurgyEngineeringMicrofabricationBrass Micro FlakesFabrication TechniqueApplied PhysicsNovel ApproachPowder CompactionElectronic Packaging3D PrintingMicrostructureMetal Processing
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