Sri Krishna Bhogaraju

Novel approach to copper sintering using surface enhanced brass micro flakes for microelectronics packaging

Sri Krishna Bhogaraju, Fosca Conti, Hiren R. Kotadia et al. · Journal of Alloys and Compounds · 2020 · 49 citations · Full text

Engineering, Materials Engineering, Materials Science +13

Die-attach bonding for high temperature applications using thermal decomposition of copper(II) formate with polyethylene glycol

Sri Krishna Bhogaraju, Omid Mokhtari, Fosca Conti et al. · Scripta Materialia · 2020 · 40 citations

Natural Sciences, Materials Engineering, Materials Science +13

Die-Attach Bonding with Etched Micro Brass Metal Pigment Flakes for High-Power Electronics Packaging

Sri Krishna Bhogaraju, Hiren R. Kotadia, Fosca Conti et al. · ACS Applied Electronic Materials · 2021 · 29 citations

Natural Sciences, Materials Engineering, Materials Science +15

Formation of tin-based crystals from a SnAgCu alloy under formic acid vapor

Fosca Conti, Omid Mokhtari, Sri Krishna Bhogaraju et al. · New Journal of Chemistry · 2018 · 26 citations

Natural Sciences, Materials Engineering, Materials Science +11

Comparison of Nondestructive Testing Methods for Solder, Sinter, and Adhesive Interconnects in Power and Opto-Electronics

Maximilian Schmid, Sri Krishna Bhogaraju, Erjia Liu et al. · Applied Sciences · 2020 · 24 citations · Full text

Engineering, Electrical Engineering, Materials Engineering +12