Maximilian Schmid

Transient thermal analysis as measurement method for IC package structural integrity

Alexander Hanß, Maximilian Schmid, E Liu et al. · Chinese Physics B · 2015 · 49 citations

Engineering, Electrical Engineering, Power Electronics +16

Analysis of solder joint reliability of high power LEDs by transient thermal testing and transient finite element simulations

Gordon Elger, Shri Vishnu Kandaswamy, E. Liu et al. · Microelectronics Journal · 2015 · 46 citations

Engineering, Electrical Engineering, Materials Engineering +17

Transient thermal analysis for accelerated reliability testing of LEDs

Gordon Elger, Dominik N. Müller, Alexander Hanß et al. · Microelectronics Reliability · 2016 · 29 citations

Engineering, Electrical Engineering, Mechanical Engineering +14

Comparison of Nondestructive Testing Methods for Solder, Sinter, and Adhesive Interconnects in Power and Opto-Electronics

Maximilian Schmid, Sri Krishna Bhogaraju, Erjia Liu et al. · Applied Sciences · 2020 · 24 citations · Full text

Engineering, Electrical Engineering, Materials Engineering +12

Investigations on High-Power LEDs and Solder Interconnects in Automotive Application: Part I—Initial Characterization

Maximilian Schmid, Andreas Zippelius, Stephan Böckhorst et al. · IEEE Transactions on Device and Materials Reliability · 2022 · 22 citations · Full text

Engineering, Materials Engineering, Materials Science +17