Shri Vishnu Kandaswamy

Analysis of solder joint reliability of high power LEDs by transient thermal testing and transient finite element simulations

Gordon Elger, Shri Vishnu Kandaswamy, E. Liu et al. · Microelectronics Journal · 2015 · 46 citations

Engineering, Electrical Engineering, Materials Engineering +17

Transient Thermal Analysis as a Highly Sensitive Test Method for the Reliability Investigation of High Power LEDs During Temperature Cycle Tests

Gordon Elger, Shri Vishnu Kandaswamy, Robert Derix et al. · Journal of Microelectronics and Electronic Packaging · 2014 · 21 citations · Full text

Engineering, Electrical Engineering, Materials Science +17

Detection of solder joint cracking of high power leds on AI-IMS during temperature shock test by transient thermal analysis

Gordon Elger, Shri Vishnu Kandaswamy, Robert Derix et al. · 2014 · 17 citations

Engineering, Electrical Engineering, Materials Engineering +17

In-Situ measurements of the relative thermal resistance: Highly sensitive method to detect crack propagation in solder joints

Gordon Elger, Shri Vishnu Kandaswamy, Maarten von Kouwen et al. · 2014 · 12 citations

Natural Sciences, Electrical Engineering, Materials Science +16