Robert Derix

Statistics

Publications

Citations

138

H-Index

Active since

2014

Affiliations

Technische Hochschule Ingolstadt(Current)

Philips (Germany)

University of Padua

Robert Derix is an author at Technische Hochschule Ingolstadt specializing in electrical engineering, thermal analysis, and semiconductor reliability.

Publications per year

2014–2016

Publications

Analysis of solder joint reliability of high power LEDs by transient thermal testing and transient finite element simulations

Gordon Elger, Shri Vishnu Kandaswamy, E. Liu et al. · Microelectronics Journal · 2015 · 46 citations

Engineering, Electrical Engineering, Materials Engineering +17

Transient thermal analysis for accelerated reliability testing of LEDs

Gordon Elger, Dominik N. Müller, Alexander Hanß et al. · Microelectronics Reliability · 2016 · 29 citations

Engineering, Electrical Engineering, Mechanical Engineering +14

Transient Thermal Analysis as a Highly Sensitive Test Method for the Reliability Investigation of High Power LEDs During Temperature Cycle Tests

Gordon Elger, Shri Vishnu Kandaswamy, Robert Derix et al. · Journal of Microelectronics and Electronic Packaging · 2014 · 21 citations · Full text

Engineering, Electrical Engineering, Materials Science +17

Detection of solder joint cracking of high power leds on AI-IMS during temperature shock test by transient thermal analysis

Gordon Elger, Shri Vishnu Kandaswamy, Robert Derix et al. · 2014 · 17 citations

Engineering, Electrical Engineering, Materials Engineering +17

Analysis of new direct on PCB board attached high power flip-chip LEDs

Gordon Elger, Maximilian Schmid, Alexander Hanb et al. · 2015 · 13 citations

Engineering, Electrical Engineering, Materials Science +15

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