Concepedia

Alexander Hanß

AH

4

Publications

105

Citations

4

H-Index

2015

Active since

Affiliations

Technische Hochschule Ingolstadt(Current)

Alexander Hanß is an author at Technische Hochschule Ingolstadt specializing in reliability engineering, electronic packaging, and engineering.

Top concepts

EngineeringElectronic PackagingElectrical EngineeringReliability EngineeringReliabilityHeat TransferThermal EngineeringMechanical EngineeringMechanics Of MaterialsStructural Health Monitoring

Publications per year

2015–2023

4

Publications

4

Transient thermal analysis as measurement method for IC package structural integrity

Alexander Hanß, Maximilian Schmid, E Liu et al. · Chinese Physics B · 2015 · 49 citations

Engineering, Mechanical Engineering, Structural Mechanics +21

Transient thermal analysis for accelerated reliability testing of LEDs

Gordon Elger, Dominik N. Müller, Alexander Hanß et al. · Microelectronics Reliability · 2016 · 29 citations

Reliability, Electrical Engineering, Reliability Engineering +9

Investigations on High-Power LEDs and Solder Interconnects in Automotive Application: Part II—Reliability

Maximilian Schmid, Andreas Zippelius, Alexander Hanß et al. · IEEE Transactions on Device and Materials Reliability · 2023 · 16 citations · Full text

Reliability Study, Engineering, High-power Leds +19

Reliability analysis and condition monitoring of SAC+ solder joints under high thermomechanical stress conditions using neuronal networks

Andreas Zippelius, Alexander Hanß, Maximilian Schmid et al. · Microelectronics Reliability · 2022 · 11 citations · Full text

Engineering, Mechanical Engineering, Condition Monitoring +18

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