O. Ehrmann

Statistics

Publications

Citations

942

H-Index

Active since

1992

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Technische Universität Berlin

Ferdinand-Braun-Institut

Fraunhofer-Gesellschaft

Korea Advanced Institute of Science and Technology

O. Ehrmann is an author at Fraunhofer Institute for Reliability and Microintegration specializing in engineering, chip packaging, and electrical engineering.

Publications per year

1992–2018

Publications

High aspect ratio TSV copper filling with different seed layers

M. J. Wolf, Thomas Dretschkow, Bernhard Wunderle et al. · 2008 · 109 citations

Engineering, Materials Engineering, Materials Science +13

TSV based silicon interposer technology for wafer level fabrication of 3D SiP modules

Kai Zoschke, J.K. Wolf, Christina Lopper et al. · 2011 · 61 citations

Engineering, Computer Engineering, Electrical Engineering +17

Fabrication of Application Specific Integrated Passive Devices Using Wafer Level Packaging Technologies

Kai Zoschke, M. J. Wolf, Michael J. Topper et al. · IEEE Transactions on Advanced Packaging · 2007 · 56 citations

Engineering, Electrical Engineering, Materials Science +15

Fabrication of high depth-to-width aspect ratio microstructures

G. Engelmann, O. Ehrmann, J. Simon et al. · 1992 · 55 citations

Natural Sciences, Materials Engineering, Materials Science +17

Fab Integrated Packaging (FIP): a new concept for high reliability wafer-level chip size packaging

Michael J. Topper, J. Auersperg, V. Glaw et al. · 2000 · 40 citations

Engineering, Manufacturing Engineering, Microfabrication +14

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