Concepedia

E. Zakel

EZ

27

Publications

568

Citations

16

H-Index

1990

Active since

Affiliations

Technische Universität Berlin(Current)

Fraunhofer Institute for Reliability and Microintegration

E. Zakel is an author at Technische Universität Berlin specializing in engineering, materials science, and electronic packaging.

Top concepts

EngineeringMaterial ScienceElectronic PackagingMicroelectronicsMicrofabricationMaterials EngineeringApplied PhysicsMechanical EngineeringElectrical EngineeringMicrostructure

Publications per year

1990–2006

27

Publications

27

Flip chip attachment using anisotropic conductive adhesives and electroless nickel bumps

R. Aschenbrenner, Andreas Ostmann, G. Motulla et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part C · 1997 · 49 citations

Engineering, Mechanical Engineering, Flip Chip Attachment +16

Electroless deposition of bumps for TAB technology

J. Simon, E. Zakel, H. Reichl · 2002 · 46 citations

Engineering, Chemical Deposition, Printed Electronics +17

Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology

J. Kloeser, K. Heinricht, K. Kutner et al. · 2002 · 42 citations

Materials Science, Flip Chip, Electrical Engineering +15

Mounting of high power laser diodes on diamond heatsinks

E. Zakel, H. Reichl · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1996 · 36 citations

Materials Science, Materials Engineering, Engineering +13

Au-Sn bonding metallurgy of TAB contacts and its influence on the Kirkendall effect in the ternary Cu-Au-Sn

E. Zakel, H. Reichl · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1993 · 31 citations

Engineering, Chemistry, Tab Contacts +17

Rows per page

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