J. Kloeser

Publications

280

Citations

H-Index

1994

Active since

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Technische Universität Berlin

Georgia Institute of Technology

Siegert Electronic (Germany)

J. Kloeser is an author at Fraunhofer Institute for Reliability and Microintegration specializing in microfabrication, microelectronics, and engineering.

Top concepts

EngineeringElectronic PackagingMicroelectronicsMicrofabricationMaterial ScienceMechanical EngineeringMaterials EngineeringElectrical EngineeringApplied Physics3D Printing

Publications per year

1994–2002

Publications

Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology

J. Kloeser, K. Heinricht, K. Kutner et al. · 2002 · 42 citations

Materials Science, Flip Chip, Electrical Engineering +15

Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology

J. Kloeser, K. Heinricht, K. Kutzner et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part C · 1998 · 32 citations

Materials Science, Flip Chip, Flip Chip Technology +15

Bump formation for flip chip and CSP by solder paste printing

J. Kloeser, P. Coskina, R. Aschenbrenner et al. · Microelectronics Reliability · 2002 · 30 citations

Materials Science, Flip Chip, Engineering +10

Low cost bumping by stencil printing: process qualification for 200 μm pitch

J. Kloeser, K. Heinricht, Erik Jung et al. · Microelectronics Reliability · 2000 · 27 citations

Stencil Printing, Mechanical Engineering, Fabrication Technique +3

Reliability investigations of fluxless flip-chip interconnections on green tape ceramic substrates

J. Kloeser, E. Zakel, Franz Bechtold et al. · 1995 · 27 citations

Engineering, Fluxless Flip Chip, Mechanical Engineering +16

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