J. Kloeser - Concepedia

Author

J. Kloeser

Fraunhofer Institute for Reliability and Microintegration

Also Known As

J. Kloeser, Joachim Kloeser, Klöser, J.

Publications

324

Citations

H-Index

Concepts

All Affiliations

Fraunhofer Institute for Reliability and Microintegration Technische Universität Berlin Georgia Institute of Technology Siegert Electronic (Germany)

About

J. Kloeser is an author at Fraunhofer Institute for Reliability and Microintegration specializing in microfabrication, microelectronics, and engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	11	12	253
2	Electrical Engineering	6	6	122
3	Materials Engineering	6	6	112
4	Applied Physics	4	4	69
5	Computer Engineering	2	2	24

J. Kloeser

Publications

280

Citations

H-Index

Page 1

	Year	Citations
Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology J. Kloeser, K. Heinricht, K. Kutner, Materials ScienceFlip ChipElectrical EngineeringFlip Chip TechnologyEngineering	2002	42
Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology J. Kloeser, K. Heinricht, K. Kutzner, IEEE Transactions on Components Packaging and Manufacturing Technology Part C Materials ScienceFlip ChipFlip Chip TechnologyEngineeringAdvanced Packaging (Semiconductors)	1998	32
Bump formation for flip chip and CSP by solder paste printing J. Kloeser, P. Coskina, R. Aschenbrenner, Microelectronics Reliability Materials ScienceFlip ChipEngineeringAdvanced Packaging (Semiconductors)Microfabrication	2002	30
Low cost bumping by stencil printing: process qualification for 200 μm pitch J. Kloeser, K. Heinricht, Erik Jung, Microelectronics Reliability Stencil PrintingMechanical EngineeringFabrication TechniquePrinted ElectronicsProcess Qualification	2000	27
Reliability investigations of fluxless flip-chip interconnections on green tape ceramic substrates J. Kloeser, E. Zakel, Franz Bechtold, EngineeringFluxless Flip ChipMechanical EngineeringSingle Chip BondingFluxless Flip-chip Interconnections	1995	27
Experimental and numerical reliability investigations of FCOB assemblies with process-induced defects Andreas Schubert, R. Dudek, J. Kloeser, EngineeringMechanical EngineeringNumerical Reliability InvestigationsProcess-induced DefectsDefect Tolerance	2000	24
Fluxless flip chip assembly on rigid and flexible polymer substrates using the Au-Sn metallurgy E. Zakel, J. Gwiasda, J. Kloeser, EngineeringMechanical EngineeringFlip ChipAdvanced Packaging (Semiconductors)Electronic Packaging	1994	21
Reliability investigations of fluxless flip-chip interconnections on green tape ceramic substrates J. Kloeser, E. Zakel, F. Bechtold, IEEE Transactions on Components Packaging and Manufacturing Technology Part A EngineeringFluxless Flip ChipMechanical EngineeringSingle Chip BondingFluxless Flip-chip Interconnections	1996	18
Numerical and experimental investigations of large IC flip chip attach Andreas Schubert, R. Dudek, R. Leutenbauer, Flip Chip TechnologyEngineeringVlsi DesignExperimental InvestigationsComputer Architecture	2000	13
Low Cost Flip Chip Technologies Based on Chemical Nickel Bumping and Solder Printing J. Kloeser, J. Gwiasda, E. Zakel, Materials ScienceChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Microfabrication	1996	13

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