Concepedia

K. Heinricht

KH

Statistics

Publications

4

Citations

110

H-Index

4

Active since

1998

Affiliations

Technische Universität Berlin(Current)

Fraunhofer Institute for Reliability and Microintegration

K. Heinricht is an author at Technische Universität Berlin specializing in electronic packaging, microfabrication, and microelectronics.

Top concepts

EngineeringMicroelectronicsMicrofabricationElectronic PackagingMaterial ScienceElectrical EngineeringMechanical Engineering3D PrintingMicrostructureComputer Engineering

Publications per year

1998–2002

4

Publications

4

Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology

J. Kloeser, K. Heinricht, K. Kutner et al. · 2002 · 42 citations

Materials Science, Flip Chip, Electrical Engineering +15

Wafer-level chip size package (WL-CSP)

Michael J. Topper, S. Fehlberg, K. Scherpinski et al. · IEEE Transactions on Advanced Packaging · 2000 · 30 citations

Electrical Engineering, Chip-scale Package, Engineering +12

Low cost bumping by stencil printing: process qualification for 200 μm pitch

J. Kloeser, K. Heinricht, Erik Jung et al. · Microelectronics Reliability · 2000 · 27 citations

Stencil Printing, Mechanical Engineering, Fabrication Technique +3

Alternative solders for flip chip applications in the automotive environment

Erik Jung, K. Heinricht, J. Kloeser et al. · 1998 · 11 citations

Materials Engineering, Materials Science, Flip Chip Technology +12

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