S. Fehlberg

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Publications

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Active since

2000

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

S. Fehlberg is an author at Fraunhofer Institute for Reliability and Microintegration specializing in packaging engineering, semiconductor devices, and wafer bonding.

Publications per year

2000–2002

Publications

Fab Integrated Packaging (FIP): a new concept for high reliability wafer-level chip size packaging

Michael J. Topper, J. Auersperg, V. Glaw et al. · 2000 · 40 citations

Engineering, Manufacturing Engineering, Microfabrication +14

Wafer-level chip size package (WL-CSP)

Michael J. Topper, S. Fehlberg, K. Scherpinski et al. · IEEE Transactions on Advanced Packaging · 2000 · 30 citations

Engineering, Electrical Engineering, Microelectronics +12

Wafer level package using double balls

Michael J. Topper, V. Glaw, P. Coskina et al. · 2002 · 16 citations

Engineering, Computer Engineering, Electronic Materials +15

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